Sustainable Packaging Innovation Forum USA – Chicago

27oct(oct 27)12:00 pm28(oct 28)12:00 pmSustainable Packaging Innovation Forum USA – Chicago

Event Details

The Study at University of Chicago, Chicago, IL

Theme: Innovation for brand value and business resilience. Join key decision makers and experts in the packaging space who are tired of surface-level sustainability talk and industry echo chambers. Expect less jargon and more case studies and practical solutions. This year’s themes: Material and design choices; Packaging as an asset; The opportunities in compliance; and Innovation for business resilience.

Time

October 27, 2026 12:00 pm - October 28, 2026 12:00 pm(GMT+00:00)

Location

Chicago, IL, USA

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